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| CM1411 2 Channel Headset/Speaker EMI Filter with ESD Protection Features * * * * * * * * * * * * Functionally and pin compatible with CMD's CSPEMI201A OptiGuardTM coated for improved reliability at assembly Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection in each channel (HBM) Supports AC signals--ideal for audio applications Extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.950mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CM1411 is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support AC signals with a cutoff frequency of 31MHz, enabling audio signals to pass through without distortion. In addition, the CM1411 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CM1411 can safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The CM1411 is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1411 incorporates OptiGuardTM coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Applications * * * * * * * EMI filtering and ESD protection for headset/speaker ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Electrical Schematic A1 10 C1 100pF SPKR_IN1 SPKR_OUT1 100pF SPKR_IN2 A3 10 C3 100pF SPKR_OUT2 100pF GND B2 (c) 2005 California Micro Devices Corp. All rights reserved. 09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CM1411 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) SPKR_OUT1 SPKR_OUT2 123 A C1 C3 GND B C CA B2 Pin "A1" Marking SPKR_IN1 SPKR_IN2 A1 A3 A1 Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1411 CSP Package PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME SPKR_IN1 SPKR_IN2 GND SPKR_OUT1 SPKR_OUT2 DESCRIPTION Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry) Device Ground Speaker Output 1 (to speaker) Speaker Output 2 (to speaker) Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 5 Package CSP Ordering Part Number1 CM1411-03CS Part Marking CA Lead-free Finish2 Ordering Part Number1 CM1411-03CP Part Marking CA Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 09/15/05 CM1411 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL R C ILEAK VSIG PARAMETER Resistance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 VIN=5.0V ILOAD = 10mA 5 -5 15 8 Notes 2,3,4 and 5 +15 -19 R = 10, C = 100pF 31 V V MHz 7 -10 CONDITIONS MIN 9 80 TYP 10 100 MAX 11 120 1.0 15 -15 UNITS pF A V V kV kV VESD Notes 2,4 and 5 VCL fC Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. (c) 2005 California Micro Devices Corp. All rights reserved. 09/15/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CM1411 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2) (c) 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 09/15/05 CM1411 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile (c) 2005 California Micro Devices Corp. All rights reserved. 09/15/05 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CM1411 Mechanical Details CSP Mechanical Specifications The CM1411 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 B2 B1 C B A2 C1 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max A 123 C2 0.905 0.950 0.995 0.0356 0.0374 0.0392 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.175 0.225 0.275 0.0069 0.0089 0.0108 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS D1 SIDE VIEW Package Dimensions for CM1411 Chip Scale Package # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1411 CHIP SIZE (mm) 1.41 X 0.95 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.720 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 6. Tape and Reel Mechanical Data (c) 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 09/15/05 |
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